Attach Die

US$9,999.00-99,999.00 / Piece

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Semiconductor IC Advanced Packaging Die Attach Die Bonding Flip-Chip Eutectic Die Attach Eutectic Bonding Machine pictures & photos

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What is Semiconductor IC Advanced Packaging Die Attach Die Bonding Flip-Chip Eutectic Die Attach Eutectic Bonding Machine

Name: Semiconductor IC Advanced Packaging Die Attach Die Bonding Flip-Chip Eutectic Die Attach Eutectic Bonding Machine
Uploaded: 2025-03-10T15:31:30+08:00
Description: Fully Automatic High-precision Eutectic Die Bonder Eutectic Bonding Machine Suitable for the packaging process of high-precision multi chip SMT; Suitable for bonding substrates and chips in COB/COC

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About this Item

Price

Min. Order Reference FOB Price

1 Piece US$9,999.00-99,999.00 / Piece

Sepcifications

After-sales Service 1 Year
Condition New
Speed High Speed
Precision High Precision
Certification CE
Warranty 12 Months
Automatic Grade Automatic
Type High-speed Chip Mounter
Transport Package Wooden Case
Trademark minder-hightech
Origin China

Product Description

Fully Automatic High-precision Eutectic Die Bonder Eutectic Bonding Machine Suitable for the packaging process of high-precision multi chip SMT; Suitable for bonding substrates and chips in COB/COC processes, through adhesive solidification process and heating eutectic process; Linear dual ...

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Guangzhou Minder-Hightech co.,Ltd

Diamond Member Since 2017

Audited Supplier

Business Range Electrical & Electronics, Industrial Equipment & Components, Manufacturing & Processing Machinery, Service
Year of Establishment 2014-12-30
Registered Capital 147802.18 USD
Main Markets North America, Europe

Attach Die Comparison

	Quick View Semiconductor IC Advanced Packaging Die Attach Die Bonding Flip-Chip Eutectic Die Attach Eutectic Bonding Machine Contact Now	Panasonic Npm-D3 Pick and Place Machine Contact Now	Quick View Neoden 4 Chip Mounter Machine Surface Mount Machines Pick and Place Machine PCB Contact Now	Quick View Automatic Neoden 6 Head Prototype PCB Assembly Visual SMT LED Pick and Place Machine Chip Mounter Machine Contact Now	Quick View New Design Neoden N10p PCB Assembly SMT Line Surface Mount Machines with Automatic Nozzle Change Function Contact Now

Transaction Info
	Quick View Semiconductor IC Advanced Packaging Die Attach Die Bonding Flip-Chip Eutectic Die Attach Eutectic Bonding Machine Contact Now	Panasonic Npm-D3 Pick and Place Machine Contact Now	Quick View Neoden 4 Chip Mounter Machine Surface Mount Machines Pick and Place Machine PCB Contact Now	Quick View Automatic Neoden 6 Head Prototype PCB Assembly Visual SMT LED Pick and Place Machine Chip Mounter Machine Contact Now	Quick View New Design Neoden N10p PCB Assembly SMT Line Surface Mount Machines with Automatic Nozzle Change Function Contact Now
Price	US $ 9,999.00-99,999.00/ Piece	US $ 35000/ Piece	US $ 2899/ Set	US $ 13999/ Piece	US $ 19999/ Set
Min Order	1 Pieces	1 Pieces	1 Sets	1 Pieces	1 Sets
Payment Terms	L/C, T/T, D/P, Western Union, Paypal, Money Gram	T/T, Western Union	T/T, Western Union, Paypal	L/C, T/T, Paypal	T/T, Western Union, Paypal
Quality Control
Product Certification	CE	CE	CE	ISO	-
Management System Certification	-	ISO 9001	ISO 9001, ISO 9000, ISO 20000, ISO 14064, QC 080000	ISO 9001, ISO 9000, ISO 20000, ISO 14064, QC 080000	ISO 9001, ISO 9000, ISO 20000, ISO 14064, QC 080000
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	US$1 Million - US$2.5 Million	Above US$100 Million	US$5 Million - US$10 Million	US$5 Million - US$10 Million	US$5 Million - US$10 Million
Business Model	Own Brand(minder-hightech)	OEM	ODM, Own Brand(NeoDen)	ODM, Own Brand(NeoDen)	ODM, Own Brand(NeoDen)
Average Lead Time	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: one month	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays
Product Attributes
Specification	After-sales Service: 1 Year; Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Type: High-speed Chip Mounter;	After-sales Service: Online; Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Type: High-speed Chip Mounter; Brand: Brand; Model: Decan S2; Number of Spindles: 10 Spindels 2 Gantry;* Placement Speed: 92,000 Cph; Vision: Flying Vision; Component Range: 03015 ~ Max. 55nn (H15mm); PCB Size: 5040 ~510460mm; Feeder Capacity: 120ea (8mm); Power: 3phase 220V 50/60Hz; Air Consumption: 50ni/Min; Weight: 1800kg; Dimension: 143017401485mm;	After-sales Service: 2 Years Warranty; Condition: New; Speed: Medium Speed; Precision: High Precision; Warranty: 24 Months; Automatic Grade: Automatic; Type: Medium-speed Chip Mounter; Application: SMD Assembly; Feeder Qty: 52 (All 8mm); Nozzle Change Capacity: 3 Nozzle Slots; Placement Rate: 3,000cph (Vision on)-4,000cph (Vision off); Component Range: 0201, 0402, BGA, Qfn, Tqfp, Fpga; Max. PCB Size: 249 X 350mm(with 2 Sides Tape Feeders)); Alignment: Vision & Vacuum; Accuracy: +-0.02mm; Power: 50W; Air Supply: >0.6MPa; Max Component Height: 12mm; Z-Axis Max Movement Range: 28mm; Control System: One-Board Integration; Weight: 47kgs(Plywood Case); Packing Size: 700(L)X610(W)X620(H)mm;	After-sales Service: 2 Years; Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 24 Months; Automatic Grade: Automatic; Type: High-speed Chip Mounter; Max Speed: 1,4000cph; Average Speed: 9000cph for Drive Board; Nozzle Head: 6; Vision: Flying Vision System; Feeder Qty: 53PCS (If 8mm); Packing Size: 12419031562mm; Smallest Component: Imperial 0201; Max PCB Width: 300mm; Max PCB Length: 800mm;	After-sales Service: 2 Years Warranty; Condition: New; Speed: Medium Speed; Precision: High Precision; Warranty: 24 Months; Automatic Grade: Automatic; Type: Medium-speed Chip Mounter; Head Qty: 8; Feeder Qty: 80; Max. PCB Size: 450mm1500mm;* Accuracy: 0.01mm; Power: 600W; PCB Thickness: 0.2mm-3.5mm;
Supplier Name	Guangzhou Minder-Hightech co.,Ltd	Shenzhen Jaguar Automation Equipment Co., Ltd.	Zhejiang NeoDen Technology Co., Ltd.	Zhejiang NeoDen Technology Co., Ltd.	Zhejiang NeoDen Technology Co., Ltd.
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