Circuit Board
US$3.20-9.80 / Piece
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What is Semiconductor Test Board Load Board Circuit Board PCB

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

100-9,999 Pieces US$9.80

10,000+ Pieces US$3.20

Sepcifications

  • Structure Multilayer Rigid PCB
  • Dielectric FR-4
  • Material Epoxy Paper Laminate
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Processing Technology Enig
  • Production Process Additive Process
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Brand 1
  • Transport Package Vacuum + Carton Packing
  • Specification 1
  • Trademark 1
  • Origin Made in China
  • Layer Count up to 52+Layer
  • Board Thickness >=280 Mils
  • Dut Pitch,Min. up to 0.35mm
  • Thickness Tolerance(%) 5-7
  • Warp and Twist up to 2 (Mils Per Inch)

Product Description

Description: The load board is used to connect the test unit of the testing device and the physical and circuit interfaces of the device under test (DUT). It can be fixed on the probe test console, handler, or other testing hardware. The wires of the load board are connected to the probe of the ...

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Circuit Board Comparison
Transaction Info
Price US $ 3.20-9.80/ Piece US $ 2.99-4.23/ Piece US $ 4.53-6.34/ Piece US $ 0.13-0.26/ Piece US $ 0.15-0.32/ piece
Min Order 100 Pieces 1 Pieces 1 Pieces 1 Pieces 1 piece
Payment Terms T/T, Western Union, Paypal L/C, T/T, Western Union, Paypal L/C, T/T, Western Union, Paypal L/C, T/T, D/P, Western Union, Paypal L/C, T/T, Western Union, Paypal
Quality Control
Product Certification - - - RoHS UL -
Management System Certification ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue US$50 Million - US$100 Million - - - -
Business Model OEM, ODM OEM, ODM OEM, ODM OEM, ODM OEM, ODM
Average Lead Time Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Product Attributes
Specification
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Enig;
Production Process: Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: 1;
Layer Count: up to 52+Layer;
Board Thickness: >=280 Mils;
Dut Pitch,Min.: up to 0.35mm;
Thickness Tolerance(%): 5-7;
Warp and Twist: up to 2 (Mils Per Inch);
Structure: Multilayer Rigid PCB;
Dielectric: Aluminum;
Material: Aluminum;
Application: Consumer Electronics;
Flame Retardant Properties: V2;
Processing Technology: PCB Assembly;
Production Process: PCB Assembly;
Base Material: Aluminum;
Insulation Materials: Metal Composite Materials;
Board Material: Aluminum;
Board Layer: 1;
Board Thickness: 1.0 mm;
Copper Thickness: 2 Oz;
Min. Hole Size: 0.20 mm;
Min Line Width&Space: 0.15 mm;
Solder Mask: White/Black;
Silksreen: Black/ White;
Surface Fnishing: OSP;
Lead Time: 5-6 Working Days;
Structure: Multilayer Rigid PCB;
Dielectric: Aluminum;
Material: Aluminum;
Application: Consumer Electronics;
Flame Retardant Properties: V2;
Processing Technology: PCB Assembly;
Production Process: PCB Assembly;
Base Material: Aluminum;
Insulation Materials: Metal Composite Materials;
Board Material: Aluminum;
Board Layer: 1;
Board Thickness: 1.0 mm;
Copper Thickness: 2 Oz;
Min. Hole Size: 0.20 mm;
Min Line Width&Space: 0.15 mm;
Solder Mask: White/Black;
Silksreen: Black/ White;
Surface Fnishing: OSP;
Lead Time: 5-6 Working Days;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Medical Instruments;
Flame Retardant Properties: HB;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Fastline;
Board Material: Fr4;
Board Layer: 4;
Board Thickness: 1.6mm;
Copper Thickness: 2 Oz;
Max PCB Size: 650*650mm;
Min Hole: 0.1mm;
Min Trace: 0.15mm;
Surface Finishing: Enig;
Solder Mask: Any;
Lead Time: 4-5 Working Days;
Test: 100%;
Service: One-Stop;
Packaging: Vacuum + Carton;
Payment: T/T,Paypal,Western Union;
Structure: Double-Sided Rigid PCB;
Dielectric: FR-3;
Material: Phenolic Paper Laminate;
Application: Computer;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Brand: Fastline;
Board Material: Fr4;
Layers: 1 to 30 Layers;
Board Thickness: 1.6mm;
Copper Thickness: 1oz;
Solder Mask: Green;
Silk Screen: White;
Surface Treatment: HASL Lead Free;
Test: 100%;
Lead Time: 6-8 Working Days;
Min. Line Width: 0.075mm;
Supplier Name

Shanghai Gawin Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Fastline Circuits Co., Limited

Diamond Member Audited Supplier

Fastline Circuits Co., Limited

Diamond Member Audited Supplier

Fastline Circuits Co., Limited

Diamond Member Audited Supplier

Fastline Circuits Co., Limited

Diamond Member Audited Supplier