Specification |
Application: Electronic Devices, Lighting, Semiconductors, Industrial Ceramic, Electronic Ceramic;
Conductive Layer: Thick Copper Layer;
Material: Alumina Ceramic;
Process: Tape Casting;
Thickness: 0.2-2mm;
Delivery: 30 Days;
Thermal Conductivity: Min 24 W/Mk;
Young's Modulus: 340 Gpa;
Forming Method: Tape Casting;
Purity: 99%;
Type: Ceramic Plates;
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Application: Industrial Ceramic, Rto/Rco & Heat Storage;
Material: Alumina, Mullite, Cordierite, Corundum;
Cell Shape: Square Cell;
Cell Number: 25 Cell, 40 Cell, 43 Cell, 50 Cell, 60 Cell;
Groove: Plate, Single, Double, Cross, Four Footer, Chute;
Type: Honeycomb Ceramic Thermal Storage Media;
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Application: Industrial Ceramic, Rto/Rco & Heat Storage;
Material: Alumina, Mullite, Cordierite, Corundum;
Cell Shape: Square Cell;
Cell Number: 5X5 Cells - 60X60 Cells;
Groove: Plate, Single, Double, Cross, Four Footer, Chute;
Type: Honeycomb Ceramic Thermal Storage Media;
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Application: Industrial Ceramic, Rto/Rco & Heat Storage;
Material: Alumina, Mullite, Cordierite, Corundum;
Cell Number: 60 Cell;
Density: 2.45-2.70;
Groove: Plate, Single, Double, Cross, Four Footer, Chute;
Type: Honeycomb Ceramic Thermal Storage Media;
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Application: Industrial Ceramic, Rto/Rco & Heat Storage;
Material: Alumina, Mullite, Cordierite, Corundum;
Cell Number: 60 Cell;
Density: 2.16-2.48;
Groove: Plate, Single, Double, Cross, Four Footer, Chute;
Type: Honeycomb Ceramic Thermal Storage Media;
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