Basic Info.
Model NO.
16Gb TC58NVG4D2HTA00 2GB THGBM4G4D1HBA 16GB THGB
Manufacturing Technology
Logic IC
Type
Intrinsic Semiconductor
Product Description
4GB THGBM5G5A1JBAIR THGBM5G5A1JBAIR is 4-GByte density of e-MMC Module product housed in 153 ball BGA package. This unit is
Utilized advanced Toshiba NAND flash device(s) and controller chip assembled as Multi Chip Module.
THGBM5G5A1JBAIR has an industry standard MMC protocol for easy use.
FEATURES
THGBM5G5A1JBAIR Interface
THGBM5G5A1JBAIR has the JEDEC/MMCA Version 4.41 interface with either 1-I/O, 4-I/O and 8-I/O mode support.
Furthermore following several new functions that defined in JEDEC/MMCA Version 4.5 were supported.
-
200MHz SDR / Sanitize / Discard / Packed command 8/ Power off notification / Large sector size
8GB THGBM5G6A2JBAIR THGBM5G6A2JBAIRToshibaFlash Card 8GB 3.3V NANDrive
8GB THGBM5G6A2JBAIR
THGBM5G6A2JBAIR is 8-GByte density of e-MMC Module product housed in 153 ball BGA package. This unit is utilized advanced Toshiba NAND flash device(s) and controller chip assembled as Multi Chip Module.
THGBM5G6A2JBAIR has an industry standard MMC protocol for easy use.
16GB THGBM5G7A2JBAIR THGBM5G7A2JBAIR is 16-GByte density of e-MMC Module product housed in 153 ball BGA package. This unit is utilized advanced Toshiba NAND flash device(s) and controller chip assembled as Multi Chip Module. THGBM5G7A2JBAIR has an industry standard MMC protocol for easy use. FEATURES THGBM5G7A2JBAIR Interface THGBM5G7A2JBAIR has the JEDEC/MMCA Version 4.41 interface with either 1-I/O, 4-I/O and 8-I/O mode support. Furthermore following several new functions that defined in JEDEC/MMCA Version 4.5 were supported. - 200MHz SDR / Sanitize / Discard / Packed command / Power off notification / Large sector size
32GB THGBM5G8A4JBAIR THGBM5G8A4JBAIR is 32-GByte density of e-MMC Module product housed in 153 ball BGA package. This unit is
Utilized advanced Toshiba NAND flash device(s) and controller chip assembled as Multi Chip Module.
THGBM5G8A4JBAIR has an industry standard MMC protocol for easy use.
FEATURES
THGBM5G8A4JBAIR Interface
THGBM5G8A4JBAIR has the JEDEC/MMCA Version 4.41 interface with either 1-I/O, 4-I/O and 8-I/O mode support.
Furthermore following several new functions that defined in JEDEC/MMCA Version 4.5 were supported.
-
200MHz SDR / Sanitize / Discard / Packed command / Power off notification / Large sector size
64GB THGBM5G9A8JBAIG THGBM5G9A8JBAIG is 64-GByte density of e-MMC Module product housed in 153 ball BGA package. This unit is utilized advanced Toshiba NAND flash device(s) and controller chip assembled as Multi Chip Module. THGBM5G9A8JBAIG has an industry standard MMC protocol for easy use. FEATURES THGBM5G9A8JBAIG Interface THGBM5G9A8JBAIG has the JEDEC/MMCA Version 4.41 interface with either 1-I/O, 4-I/O and 8-I/O mode support. Furthermore following several new functions that defined in JEDEC/MMCA Version 4.5 were supported. - 200MHz SDR / Sanitize / Discard / Packed command / Power off notification / Large sector size
64GB THGBM5G9B8JBAIE THGBM5G9B8JBAIE is 64-GByte density of e-MMC Module product housed in 169 ball BGA package. This unit is
Utilized advanced Toshiba NAND flash device(s) and controller chip assembled as Multi Chip Module.
THGBM5G9B8JBAIE has an industry standard MMC protocol for easy use.
FEATURES
THGBM5G9B8JBAIE Interface
THGBM5G9B8JBAIE has the JEDEC/MMCA Version 4.41 interface with either 1-I/O, 4-I/O and 8-I/O mode support.
Furthermore following several new functions that defined in JEDEC/MMCA Version 4.5 were supported.
Address:
Room 1313 Building1 Shu Xiang Men Di Shang He Fang Minzhi BaoAn Shenzhen 518131
Business Type:
Trading Company
Business Range:
Electrical & Electronics
Company Introduction:
We are the Toshiba distributor and provide solutions for our customers. Including Memory and ICs. If you have any inquiries, please feel free to contact with us.
