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Espressif Sales Agent Espressif Inc Esp32 Bluetooth Esp32-Pico-V3 Datasheet

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Shenzhen Ferry Technology Co., Ltd

Guangdong, China

Last Login Date:

Aug 08, 2024

Business Type:

Manufacturer/Factory

Main Products:

Espressif Wi-Fi Bluetooth, Espressif Esp32-H2, Espressif Esp32-S3, Espressif Esp32-S2, Espressif Esp32-C6, Espressif Esp32-C2, Espressif Esp8266

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Basic Info.

Model NO.

ESP32-PICO-V3 Datasheet

Type

WiFi Module

Work Mode

AP+STA

WiFi Antenna Type

Built-in

Transmission Rate

151-200Mbps

Voltage

3.3V

Antenna Gain

23dBi

Color

Black

Certification

RoHS, FCC, CE

Transport Package

Box

Product Description

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Espressif Sales agent espressif inc esp32 bluetooth ESP32-PICO-V3 Datasheet
ESP32-PICO-V3
Datasheet

1Overview

1.1Features

MCU
•ESP32 embedded, Xtensa® dual-core 32-bit LX6 microprocessor, up to 240 MHz
•448 KB ROM for booting and core functions
•520 KB SRAM for data and instructions
•16 KB SRAM in RTC

Wi-Fi
•802.11 b/g/n
•Bit rate: 802.11n up to 150 Mbps
•A-MPDU and A-MSDU aggregation
•0.4 µs guard interval support
•Center frequency range of operating channel: 2412 ~ 2484 MHz

Bluetooth®
•Bluetooth V4.2 BR/EDR and Bluetooth LE specification
•
Class-1, class-2 and class-3 transmitter

•AFH

•CVSD and SBC

Hardware
•Interfaces: ADC, DAC, touch sensor, SD/SDIO/MMC Host Controller, SPI, SDIO/SPI Slave Controller, EMAC, motor PWM, LED PWM, UART, I2C, I2S, infrared remote controller, GPIO, pulse counter, Two-Wire Automotive Interface (TWAI®, compatible with ISO11898-1)

•40 MHz crystal oscillator

•4 MB SPI flash

•Operating voltage/Power supply: 3.0 ~ 3.6 V

•Operating temperature range: -40 ~ 85 °C

•Dimensions: (7 × 7 × 0.94) mm

1.2Description
The ESP32-PICO-V3 is a System-in-Package (SiP) device that is based on ESP32 with ECO V3 wafer, providing complete Wi-Fi and Bluetooth® functionalities. It integrates a 4 MB SPI flash.
At the core of ESP32-PICO-V3 is the ESP32 (ECO V3) chip, which is a single 2.4 GHz Wi-Fi and Bluetooth combo chip designed with TSMC's 40 nm low-power technology. ESP32-PICO-V3 integrates all peripheral components seamlessly, including a crystal oscillator, flash, filter capacitors and RF matching links in one single package. Module assembly and testing are already done at SiP level. As such, ESP32-PICO-V3 reduces the complexity of supply chain and improves control efficiency.
With its ultra-small size, robust performance and low-energy consumption, ESP32-PICO-V3 is well suited for any space-limited or battery-operated applications, such as wearable electronics, medical equipment, sensors and other IoT products.
Comparing to other ESP32 series chips, ESP32-PICO-V3 has an additional pin GPIO20. For chip security purpose, flash pins DI, DO, /HOLD, /WP are not led out.

1.3Applications

•Generic Low-power IoT Sensor Hub
•Generic Low-power IoT Data Loggers
•Cameras for Video Streaming
•Over-the-top (OTT) Devices
•Speech Recognition
•Image Recognition
•Mesh Network
•Home Automation
•Smart Building
•Industrial Automation
•Smart Agriculture
•Audio Applications
•Health Care Applications
•Wi-Fi-enabled Toys
•Wearable Electronics
•Retail & Catering Applications

3.2Pin Description
ESP32-PICO-V3 has 48 pins. See pin definitions in Table 1.

Table 1: Pin Definitions

Name	No.	Type	Function
VDDA	1	P	Analog power supply (3.0 V ~ 3.6 V)
LNA_IN	2	I/O	RF input and output
VDDA3P3	3	P	Analog power supply (3.0 V ~ 3.6 V)

Name	No.	Type	Function
VDDA3P3	4	P	Analog power supply (3.0 V ~ 3.6 V)
SENSOR_VP/I36	5	I	GPIO36, ADC1_CH0, RTC_GPIO0
SENSOR_CAPP/I37	6	I	GPIO37, ADC1_CH1, RTC_GPIO1
SENSOR_CAPN/I38	7	I	GPIO38, ADC1_CH2, RTC_GPIO2
SENSOR_VN/I39	8	I	GPIO39, ADC1_CH3, RTC_GPIO3
EN	9	I	High: On; enables the SiP Low: Off; the SiP powers off Note: Do not leave this pin floating.
VDET_1/I34	10	I	ADC1_CH6, RTC_GPIO4
VDET_2/I35	11	I	ADC1_CH7, RTC_GPIO5
32K_XP/IO32	12	I/O	32K_XP (32.768 kHz crystal oscillator input), ADC1_CH4, TOUCH9, RTC_GPIO9
32K_XN/IO33	13	I/O	32K_XN (32.768 kHz crystal oscillator output), ADC1_CH5, TOUCH8, RTC_GPIO8
IO25	14	I/O	GPIO25, DAC_1, ADC2_CH8, RTC_GPIO6, EMAC_RXD0
IO26	15	I/O	GPIO26, DAC_2, ADC2_CH9, RTC_GPIO7, EMAC_RXD1
IO27	16	I/O	GPIO27, ADC2_CH7, TOUCH7, RTC_GPIO17, EMAC_RX_DV
MTMS/IO14	17	I/O	ADC2_CH6, TOUCH6, RTC_GPIO16, MTMS, HSPICLK, HS2_CLK, SD_CLK, EMAC_TXD2
MTDI/IO12	18	I/O	ADC2_CH5, TOUCH5, RTC_GPIO15, MTDI, HSPIQ, HS2_DATA2, SD_DATA2, EMAC_TXD3
VDD3P3_RTC	19	P	Input power supply for RTC IO (3.0 V ~ 3.6 V)
MTCK/IO13	20	I/O	ADC2_CH4, TOUCH4, RTC_GPIO14, MTCK, HSPID, HS2_DATA3, SD_DATA3, EMAC_RX_ER
MTDO/IO15	21	I/O	ADC2_CH3, TOUCH3, RTC_GPIO13, MTDO, HSPICS0, HS2_CMD, SD_CMD, EMAC_RXD3
IO2	22	I/O	ADC2_CH2, TOUCH2, RTC_GPIO12, HSPIWP, HS2_DATA0, SD_DATA0
IO0	23	I/O	ADC2_CH1, TOUCH1, RTC_GPIO11, CLK_OUT1, EMAC_TX_CLK
IO4	24	I/O	ADC2_CH0, TOUCH0, RTC_GPIO10, HSPIHD, HS2_DATA1, SD_DATA1, EMAC_TX_ER
NC	25	-	NC
VDD_SDIO	26	P	Output power supply. See note 1under the table.
IO20	27	I/O	GPIO20. See note 3under the table.
SD2/IO9	28	I/O	GPIO9, SD_DATA2, HS1_DATA2, U1RXD. See note 3 under the table.
SD3/IO10	29	I/O	GPIO10, SD_DATA3, HS1_DATA3, U1TXD. See note 3 under the table.
CMD/IO11	30	I/O	See note 2, note 3under the table.
CLK/IO6	31	I/O	See note 2, note 3under the table.
SD0/IO7	32	I/O	GPIO7, SD_DATA0, HS1_DATA0, U2RTS. See note 3under the table.
SD1/IO8	33	I/O	GPIO8, SD_DATA1, HS1_DATA1, U2CTS. See note 3under the table.
IO5	34	I/O	GPIO5, VSPICS0, HS1_DATA6, EMAC_RX_CLK
NC	35	-	NC
NC	36	-	NC
VDD3P3_CPU	37	P	Input power supply for CPU IO (1.8 V ~ 3.6 V)

Name	No.	Type	Function
IO19	38	I/O	GPIO19, VSPIQ, U0CTS, EMAC_TXD0
IO22	39	I/O	GPIO22, VSPIWP, U0RTS, EMAC_TXD1
U0RXD/IO3	40	I/O	GPIO3, U0RXD, CLK_OUT2
U0TXD/IO1	41	I/O	GPIO1, U0TXD, CLK_OUT3, EMAC_RXD2
IO21	42	I/O	GPIO21, VSPIHD, EMAC_TX_EN
VDDA	43	P	Analog power supply (3.0 V ~ 3.6 V)
NC	44	-	NC
NC	45	-	NC
VDDA	46	P	Analog power supply (3.0 V ~ 3.6 V)
NC	47	-	NC
NC	48	-	NC

Notice:
1.Note that the embedded flash is connected to VDD_SDIO which is driven directly by VDD3P3_RTC through a 6
resistor. Due to this resistor, there is some voltage drop on this pin from VDD3P3_RTC.
2.Pins CMD/IO11 and CLK/IO6 are used for connecting the embedded flash, and are not recommended for other uses. For details, please see Section 5 Schematics.
3.IO6/IO7/IO8/IO9/IO10/IO11/IO20 belong to VDD_SDIO power domain and cannot work when VDD_SDIO power shuts down.
4.For peripheral pin configurations, please refer to ESP32 Datasheet.

3.3Compatibility with ESP32-PICO-D4
ESP32-PICO-V3 is a new product but it is very similar to ESP32-PICO-D4. It may be possible to update an ESP32-PICO-D4 hardware design to use ESP32-PICO-V3 with minimal or no hardware changes, but please pay attention to the following:
•Usage of six pins has changed:

Table 2: Usage of Pins on ESP32-PICO-V3 and ESP32-PICO-D4

Pin No.	ESP32-PICO-V3	ESP32-PICO-D4
25	Not connected	GPIO16, used by embedded flash
27	GPIO20, can be used	GPIO17, used by embedded flash
32	SD0 (GPIO7), can be used	SD0 (GPIO7), used by embedded flash
33	SD1 (GPIO8), can be used	SD1 (GPIO8), used by embedded flash
35	Not connected	GPIO18, can be used
36	Not connected	GPIO23, can be used

•None of the embedded flash data pins are connected externally on ESP32-PICO-V3. These are connected internally to GPIO16, GPIO17, GPIO18, and GPIO23.
•It is not possible to connect an external PSRAM chip to ESP32-PICO-V3.
•If a 32.768 kHz crystal is connected to ESP32-PICO-D4 then please refer to ESP32 ECO V3 User Guide for

information about necessary hardware changes for ESP32-PICO-V3.
•Refer to ESP32 ECO V3 User Guide for information about possible software changes and optimizations for ESP32 ECO V3.
•EMC compliance and RF performance tests should be repeated after a design is updated to use ESP32-PICO-V3.
•Refer to ESP32-PICO-D4 Datasheet for more information about ESP32-PICO-D4.

3.4Strapping Pins
ESP32 has five strapping pins: MTDI, GPIO0, GPIO2, MTDO, GPIO5. The pin-pin mapping between ESP32 and the SiP is as follows, which can be seen in Chapter 5 Schematics:
•MTDI = IO12
•GPIO0 = IO0
•GPIO2 = IO2
•MTDO = IO15
•GPIO5 = IO5
Software can read the values of these five bits from register "GPIO_STRAPPING".
During the chip's system reset release (power-on-reset, RTC watchdog reset and brownout reset), the latches of the strapping pins sample the voltage level as strapping bits of "0" or "1", and hold these bits until the chip is powered down or shut down. The strapping bits configure the device's boot mode, the operating voltage of VDD_SDIO and other initial system settings.
Each strapping pin is connected to its internal pull-up/pull-down during the chip reset. Consequently, if a strapping pin is unconnected or the connected external circuit is high-impedance, the internal weak
pull-up/pull-down will determine the default input level of the strapping pins.
To change the strapping bit values, users can apply the external pull-down/pull-up resistances, or use the host MCU's GPIOs to control the voltage level of these pins when powering on ESP32.
After reset release, the strapping pins work as normal-function pins. Refer to Table 3 for a detailed boot-mode configuration by strapping pins.
Table 3: Strapping Pins

Voltage of Internal LDO (VDD_SDIO)
Pin	Default	3.3 V	1.8 V
MTDI	Pull-down	0	1
Booting Mode
Pin	Default	SPI Boot	Download Boot
GPIO0	Pull-up	1	0
GPIO2	Pull-down	Don't-care	0
Enabling/Disabling Debugging Log Print over U0TXD During Booting
Pin	Default	U0TXD Active	U0TXD Silent
MTDO	Pull-up	1	0
Timing of SDIO Slave

Pin	Default	FE Sampling FE Output	FE Sampling RE Output	RE Sampling FE Output	RE Sampling RE Output
MTDO	Pull-up	0	0	1	1
GPIO5	Pull-up	0	1	0	1

Note:
•FE: falling-edge, RE: rising-edge.
•Firmware can configure register bits to change the settings of "Voltage of Internal LDO (VDD_SDIO)" and "Timing of SDIO Slave", after booting.
•The operating voltage of ESP32-PICO-V3's integrated external SPI flash is 3.3 V. Therefore, the strapping pin MTDI should hold bit "0" during the SiP power-on reset.

4Electrical Characteristics

4.1Absolute Maximum Ratings
Stresses beyond the absolute maximum ratings listed in the table below may cause permanent damage to the device. These are stress ratings only, and do not refer to the functional operation of the device that should follow the recommended operating conditions.

Table 4: Absolute Maximum Ratings

Symbol	Parameter	Min	Max	Unit
VDD33	Power supply voltage	-0.3	3.6	V
TSTORE	Storage temperature	-40	85	°C

4.2Recommended Operating Conditions

Table 5: Recommended Operating Conditions

Symbol	Parameter	Min	Typ	Max	Unit
VDD33	Power supply voltage	3.0	3.3	3.6	V
IV DD	Current delivered by external power supply	0.5	-	-	A
T	Operating temperature	-40	-	85	°C
Humidity	Humidity condition	-	85	-	%RH

4.3DC Characteristics (3.3 V, 25 °C)

Table 6: DC Characteristics (3.3 V, 25 °C)

Symbol	Parameter	Min	Typ	Max	Unit
CIN	Pin capacitance	-	2	-	pF
VIH	High-level input voltage	0.75×VDD¹	-	VDD¹+0.3	V
VIL	Low-level input voltage	-0.3	-	0.25×VDD¹	V
IIH	High-level input current	-	-	50	nA
IIL	Low-level input current	-	-	50	nA
VOH	High-level output voltage	0.8×VDD¹	-	-	V
VOL	Low-level output voltage	-	-	0.1×VDD¹	V

Symbol	Parameter		Min	Typ	Max	Unit
IOH	High-level source current (VDD¹ = 3.3 V, V_OH >= 2.64 V, output drive strength set to the maximum)	VDD3P3_CPU power domain ¹^, ²	-	40	-	mA
		VDD3P3_RTC power domain ¹^, ²	-	40	-	mA
		VDD_SDIO power domain ¹^, ³	-	20	-	mA
IOL	Low-level sink current (VDD¹ = 3.3 V, V_O_L = 0.495 V, output drive strength set to the maximum)		-	28	-	mA
RPU	Resistance of internal pull-up resistor		-	45	-	k
RPD	Resistance of internal pull-down resistor		-	45	-	k
VIL_nRST	Low-level input voltage of CHIP_PU to power off the chip		-	-	0.6	V

Note:

1.Please see Appendix IO_MUX of ESP32 Datasheet for IO's power domain. VDD is the I/O voltage for a particular power domain of pins.
2.For VDD3P3_CPU and VDD3P3_RTC power domain, per-pin current sourced in the same domain is gradually reduced from around 40 mA to around 29 mA, VOH >=2.64 V, as the number of current-source pins increases.
3.Pins occupied by flash and/or PSRAM in the VDD_SDIO power domain were excluded from the test.

4.4Current Consumption Characteristics
With the use of advanced power-management technologies, ESP32 can switch between different power modes.
For details on different power modes, please refer to Section RTC and Low-Power Management in
ESP32 Datasheet.

Table 7: Current Consumption Depending on RF Modes

Note:

•The current consumption measurements are taken with a 3.3 V supply at 25 °C of ambient temperature at the RF port. All transmitter measurements are based on a 100% duty cycle.
•The current consumption figures for in RX mode are for cases when the peripherals are disabled and the CPU idle.

Table 8: Current Consumption Depending on Work Modes

Work mode	Description		Current consumption (Typ)
Modem-sleep	The CPU is powered on	240 MHz	30 ~ 68 mA
		160 MHz	27 ~ 44 mA
		Normal speed: 80 MHz	20 ~ 31 mA
Light-sleep	-		0.8 mA
Deep-sleep	The ULP co-processor is powered on.		150 µA
	ULP sensor-monitored pattern		100 µA @1% duty
	RTC timer + RTC memory		10 µA
	RTC timer only		5 µA
Power off	CHIP_PU is set to low level, the chip is powered off.		1 µA

Note:

•The current consumption figures in Modem-sleep mode are for cases where the CPU is powered on and the cache idle.
•When Wi-Fi is enabled, the chip switches between Active and Modem-sleep modes. Therefore, current consump- tion changes accordingly.
•In Modem-sleep mode, the CPU frequency changes automatically. The frequency depends on the CPU load and the peripherals used.
•During Deep-sleep, when the ULP co-processor is powered on, peripherals such as GPIO and I²C are able to operate.
•The "ULP sensor-monitored pattern" refers to the mode where the ULP coprocessor or the sensor works periodi- cally. When ADC works with a duty cycle of 1%, the typical current consumption is 100 µA.

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Company Introduction: Shenzhen Ferry Technology Co., Ltd. Has been focusing on the optimization and construction of wireless communication transmission mechanism and wireless audio and video transmission solution level to provide WiFi module company, unremitting in-depth development of WiFi wireless transmission, radar induction and other low-power IOT scene microwave radar manufacturers, We are committed to bringing rich and diverse data and information into every person, home, and organization in an easily accessible way, building a smart world that connects everything: Connecting everywhere and connecting our lives to each other; Let wireless transmission without boundaries, so that intelligence at your fingertips.

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